Invention Grant
- Patent Title: Method and apparatus for massively parallel multi-wafer test
- Patent Title (中): 用于大规模并行多晶片测试的方法和装置
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Application No.: US13609154Application Date: 2012-09-10
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Publication No.: US09335347B2Publication Date: 2016-05-10
- Inventor: John W. Andberg , Ira H. Leventhal , Matthew W. Losey , Yohannes Desta , Lakshmikanth Namburi , Vincent E. Lopopolo , Sanjeev Grover , Erik Volkerink
- Applicant: John W. Andberg , Ira H. Leventhal , Matthew W. Losey , Yohannes Desta , Lakshmikanth Namburi , Vincent E. Lopopolo , Sanjeev Grover , Erik Volkerink
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST CORPORATION
- Current Assignee: ADVANTEST CORPORATION
- Current Assignee Address: JP Tokyo
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R1/04 ; G01R1/073 ; G01R35/00

Abstract:
Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel “split-cartridge” design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A “probe-card stops” design may be used within the cartridge to simplify the overall cartridge design and operation.
Public/Granted literature
- US20140070828A1 METHOD AND APPARATUS FOR MASSIVELY PARALLEL MULTI-WAFER TEST Public/Granted day:2014-03-13
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