Invention Grant
- Patent Title: Fluid injection device
- Patent Title (中): 流体注射装置
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Application No.: US14472821Application Date: 2014-08-29
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Publication No.: US09358035B2Publication Date: 2016-06-07
- Inventor: Hideki Kojima
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2010-046299 20100303
- Main IPC: B05B1/08
- IPC: B05B1/08 ; A61B17/3203

Abstract:
A fluid injection device includes a pulse generator which converts fluid into pulse flow, a suction pipe projecting from the pulse generator, an injection pipe which is eccentrically inserted into the suction pipe such that the outer circumferential surface of the injection pipe contacts the inner circumferential surface of the suction pipe, and has an injection opening communicating with the pulse generator, and a suction channel and a suction opening formed between the inner circumferential surface of the suction pipe and the outer circumferential surface of the injection pipe. The injection pipe is fixed to the inner circumferential surface of the suction pipe in the vicinity of the injection opening.
Public/Granted literature
- US20140367485A1 FLUID INJECTION DEVICE Public/Granted day:2014-12-18
Information query
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