Invention Grant
- Patent Title: Polishing system with front side pressure control
- Patent Title (中): 抛光系统带前端压力控制
-
Application No.: US14213842Application Date: 2014-03-14
-
Publication No.: US09358658B2Publication Date: 2016-06-07
- Inventor: Shou-Sung Chang , Takashi Fujikawa , Hung Chih Chen , Paul D. Butterfield
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B37/005
- IPC: B24B37/005 ; B24B37/04 ; B24B37/10 ; B24B49/16 ; B24B37/32 ; B24B37/16
Abstract:
A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.
Public/Granted literature
- US20140273765A1 Polishing System with Front Side Pressure Control Public/Granted day:2014-09-18
Information query
