Invention Grant
US09362127B2 Method for processing a workpiece by forming a pourous metal layer
有权
通过形成多孔金属层来加工工件的方法
- Patent Title: Method for processing a workpiece by forming a pourous metal layer
- Patent Title (中): 通过形成多孔金属层来加工工件的方法
-
Application No.: US13948208Application Date: 2013-07-23
-
Publication No.: US09362127B2Publication Date: 2016-06-07
- Inventor: Michael Krenzer , Thomas Kunstmann , Eva-Maria Hess , Manfred Frank
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner
- Main IPC: H01L21/285
- IPC: H01L21/285 ; H01L21/02 ; H01L23/532
Abstract:
A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer.
Public/Granted literature
- US20150031203A1 METHOD FOR PROCESSING A WORKPIECE Public/Granted day:2015-01-29
Information query
IPC分类:
