Invention Grant
- Patent Title: Etching solutions
- Patent Title (中): 蚀刻解决方案
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Application No.: US14293388Application Date: 2014-06-02
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Publication No.: US09365935B2Publication Date: 2016-06-14
- Inventor: Kwang Choon Chung , Hyun-Nam Cho , Young-Kwan Seo
- Applicant: Inktec Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Inktec Co., Ltd.
- Current Assignee: Inktec Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: The Webb Law Firm
- Priority: KR10-2005-0028508 20050406
- Main IPC: C23F1/30
- IPC: C23F1/30 ; C09K13/00 ; C23F1/14 ; C09K13/06
Abstract:
The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant: wherein each of the variables is as defined herein.
Public/Granted literature
- US20140263185A1 Etching Solutions Public/Granted day:2014-09-18
Information query
IPC分类:
