公开(公告)号：US10080299B2

公开(公告)日：2018-09-18

申请号：US14370644

申请日：2013-01-04

Applicant: INKTEC CO., LTD.

Inventor： Kwang-Choon Chung ,  Young-Koo Han ,  Myung-Bong Yoo ,  Kwang-Baek Yoon ,  Bong-Ki Jung

IPC: H05K3/40 ,  H05K3/12 ,  H05K3/24

CPC classification number: H05K3/4069 ,  H05K3/12 ,  H05K3/246 ,  H05K2201/0154 ,  H05K2203/1383 ,  Y10T29/49155

Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.

公开(公告)号：US09839138B2

公开(公告)日：2017-12-05

申请号：US14481273

申请日：2014-09-09

Applicant: Inktec Co., Ltd.

Inventor： Kwang Choon Chung ,  Ji Hoon Yoo ,  Su-Han Kim ,  Byung Hun Kim

IPC: H05K3/12 ,  H05K1/09 ,  H05K3/10

CPC classification number: H05K3/1258 ,  C23C18/165 ,  C23C18/1868 ,  C23C18/204 ,  H05K1/092 ,  H05K1/097 ,  H05K3/0026 ,  H05K3/107 ,  H05K3/245 ,  H05K2201/0112 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/0568 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/1126

Abstract: The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.

公开(公告)号：US09788418B2

公开(公告)日：2017-10-10

申请号：US14902980

申请日：2014-07-07

Applicant: INKTEC Co., Ltd.

Inventor： Kwang-Choon Chung ,  Ji Hoon Yoo ,  Joonki Seong ,  Byung Hun Kim ,  Nam-Boo Cho ,  Myung-Bong Yoo

IPC: H01K1/02 ,  H05K3/00 ,  H05K1/09 ,  H05K3/12 ,  H05K3/06 ,  H05K1/03 ,  H05K1/02 ,  G06F3/041 ,  H01L51/44

CPC classification number: H05K1/0274 ,  G06F3/041 ,  G06F2203/04103 ,  H01L51/445 ,  H05K1/0213 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/097 ,  H05K3/0026 ,  H05K3/06 ,  H05K3/067 ,  H05K3/12 ,  H05K3/1258 ,  H05K2201/0776 ,  Y02E10/549 ,  Y02P70/521

Abstract: Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.

公开(公告)号：US20160202404A1

公开(公告)日：2016-07-14

申请号：US14895500

申请日：2014-06-03

Applicant: INKTEC CO., LTD.

Inventor： Kwang-Choon CHUNG ,  Insook YI ,  MinHee KIM ,  Ji Hoon YOO

IPC: G02B5/30 ,  G02B1/08

CPC classification number: G02B5/3058 ,  G02B1/08 ,  G02B5/3033 ,  G02B5/3041

Abstract: Provided herein is a method for producing a nano polaroid film using a one-pack type or two-pack type blackening ink so that a single layer film may replace a conventional polaroid film generally produced by superposing various types of optical films, and especially, a method for producing a nano polaroid film consisting of one film and having excellent observability by coating a transparent nano pattern substrate with a functional ink that contains a blackening material, and then removing particles formed on protruding portions using an etching solution, and refilling the functional ink into grooves.

Abstract translation: 本文提供了使用单组分式或双组分型黑化油墨制造纳米偏光片的方法，使得单层薄膜可以代替通常通过叠加各种类型的光学薄膜而产生的常规的聚焦薄膜，特别地， 通过用含有黑化材料的功能油墨涂布透明纳米图案基板，然后使用蚀刻液除去形成在突出部分上的颗粒，并且重新填充功能性墨水的方法，制造由一片膜构成的纳米偏光片，并具有优异的观察性 进入槽。

公开(公告)号：US20160194339A1

公开(公告)日：2016-07-07

申请号：US15071593

申请日：2016-03-16

Applicant: Inktec Co., Ltd.

Inventor： Kwang-Choon Chung ,  Hyun-Nam Cho ,  Myoung-Seon Gong ,  Yi-Sup Han ,  Jeong-Bin Park ,  Dong-Hun Nam ,  Seong-Yong Uhm ,  Young-Kwan Seo

IPC: C07F1/00

CPC classification number: C07F1/00 ,  C07C211/65 ,  C07C271/02 ,  C07F1/005 ,  C09D5/24 ,  C09D11/30 ,  C09D11/52 ,  C23C18/08 ,  C25D3/46 ,  H05K3/105

Abstract: Provided herein is a method for preparing a silver complex. The method includes reacting a silver oxide with a mixture of ammonium carbamate and isopropyl amine at room temperature in the presence of methanol.

Abstract translation: 本文提供了制备银络合物的方法。 该方法包括在室温下在甲醇存在下使氧化银与氨基甲酸铵和异丙胺的混合物反应。

公开(公告)号：US11317514B2

公开(公告)日：2022-04-26

申请号：US16484479

申请日：2018-02-09

Applicant: InkTec Co., Ltd.

Inventor： Kwang-Choon Chung ,  Byung Woong Moon ,  Su Han Kim ,  Jung Yoon Moon ,  Hyeon-Jun Seong ,  Jae Rin Kim

IPC: H05K3/06 ,  C09K13/00 ,  H05K1/09 ,  H05K1/11 ,  H05K3/18 ,  H05K3/28 ,  H05K3/42

Abstract: The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.

公开(公告)号：US11089691B2

公开(公告)日：2021-08-10

申请号：US16489361

申请日：2018-02-27

Applicant: InkTec Co., Ltd.

Inventor： Su Han Kim ,  Kwang-Choon Chung ,  Jung Yoon Moon ,  Sung In Ha ,  Byung Woong Moon

IPC: H05K3/06 ,  C09K13/00 ,  H05K3/24 ,  H05K3/12 ,  H05K3/18 ,  H05K3/38 ,  H05K3/10

Abstract: The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

公开(公告)号：US09914743B2

公开(公告)日：2018-03-13

申请号：US15071593

申请日：2016-03-16

Applicant: Inktec Co., Ltd.

Inventor： Kwang-Choon Chung ,  Hyun-Nam Cho ,  Myoung-Seon Gong ,  Yi-Sup Han ,  Jeong-Bin Park ,  Dong-Hun Nam ,  Seong-Yong Uhm ,  Young-Kwan Seo

IPC: C23C18/08 ,  C07F1/00 ,  C07C271/02 ,  C07C211/65 ,  C09D5/24 ,  C09D11/30 ,  C09D11/52 ,  C25D3/46 ,  H05K3/10

CPC classification number: C07F1/00 ,  C07C211/65 ,  C07C271/02 ,  C07F1/005 ,  C09D5/24 ,  C09D11/30 ,  C09D11/52 ,  C23C18/08 ,  C25D3/46 ,  H05K3/105

Abstract: Provided herein is a method for preparing a silver complex. The method includes reacting a silver oxide with a mixture of ammonium carbamate and isopropyl amine at room temperature in the presence of methanol.

公开(公告)号：US09365935B2

公开(公告)日：2016-06-14

申请号：US14293388

申请日：2014-06-02

Applicant: Inktec Co., Ltd.

Inventor： Kwang Choon Chung ,  Hyun-Nam Cho ,  Young-Kwan Seo

IPC: C23F1/30 ,  C09K13/00 ,  C23F1/14 ,  C09K13/06

CPC classification number: C23F1/30 ,  C09K13/00 ,  C09K13/06 ,  C23F1/14

Abstract: The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant: wherein each of the variables is as defined herein.

Abstract translation: 本发明提供一种用于银或银合金的蚀刻溶液，其包含至少一种由下式（1），（2）或（3）表示的铵化合物和氧化剂：其中每个变量如本文所定义。

公开(公告)号：US20160132141A1

公开(公告)日：2016-05-12

申请号：US14891448

申请日：2014-05-16

Applicant: INKTEC CO., LTD.

Inventor： Kwang-Choon CHUNG ,  In-Sook YI ,  Ji Hoon YOO ,  Joonki SEONG ,  Dae sang HAN

IPC: G06F3/041

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103

Abstract: Provided herein is a method for producing a hybrid transparent electrode, the method including filling grooves of a substrate with a conductive metal ink composition; filling the grooves with residue conductive metal ink composition that remains on a surface of the substrate as the grooves are being filled with the conductive metal ink composition to form an electrode pattern; and forming a conductive layer including a conductive material on the electrode pattern.

Abstract translation: 本发明提供一种混合透明电极的制造方法，该方法包括用导电金属油墨组合物填充基材的槽; 在凹槽被导电金属油墨组合物填充以形成电极图案时，用剩余的导电金属油墨组合物填充残留的导电金属油墨组合物; 以及在所述电极图案上形成包括导电材料的导电层。