Invention Grant
- Patent Title: Metal pattern structure having positioning layer
- Patent Title (中): 具有定位层的金属图案结构
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Application No.: US14825184Application Date: 2015-08-13
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Publication No.: US09385084B2Publication Date: 2016-07-05
- Inventor: Babak Radi , Tzu-Wen Chuang , Shih-Hong Chen
- Applicant: Wistron NeWeb Corp.
- Applicant Address: TW Hsinchu
- Assignee: Wistron NeWeb Corp.
- Current Assignee: Wistron NeWeb Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW103220302U 20141114
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/528 ; H01L23/522 ; H01L23/532
Abstract:
A metal pattern structure having a positioning layer thereon is provided. The positioning layer is located within a predetermined region of the metal pattern structure and located directly on the surface of a metal layer of the metal pattern structure.
Public/Granted literature
- US20160141239A1 METAL PATTERN STRUCTURE HAVING POSITIONING LAYER Public/Granted day:2016-05-19
Information query
IPC分类:
