Invention Grant
- Patent Title: Low cost high strength surface mount package
- Patent Title (中): 低成本高强度表面贴装封装
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Application No.: US14573631Application Date: 2014-12-17
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Publication No.: US09392713B2Publication Date: 2016-07-12
- Inventor: Ching Au , Dennis Zegzula , David Peng
- Applicant: RSM Electron Power, Inc.
- Applicant Address: US NY Deer Park
- Assignee: RSM Electron Power, Inc.
- Current Assignee: RSM Electron Power, Inc.
- Current Assignee Address: US NY Deer Park
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H05K5/06 ; H01L23/055 ; H05K1/18 ; H05K1/02 ; H05K1/03 ; H05K1/09 ; H05K5/03
Abstract:
A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically insulating substrate has a plurality of apertures and an aspect ratio of about 10:1 or greater. The plurality of electrically and thermally conductive tabs is hermetically joined to a bottom surface of the electrically insulating substrate and at least one tab covers each of the apertures. The lid is hermetically joined to a top surface of the electrically insulating substrate proximate to a perimeter of the electrically insulating substrate.
Public/Granted literature
- US20160113138A1 LOW COST HIGH STRENGTH SURFACE MOUNT PACKAGE Public/Granted day:2016-04-21
Information query
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