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公开(公告)号：US09558859B2
公开(公告)日：2017-01-31
申请号：US14183492
申请日：2014-02-18
Applicant: RSM Electron Power, Inc.
Inventor： Ching Au , Manhong Zhao , Robert Conte
IPC: H01B1/02 , H05K3/24 , H01L23/373
CPC classification number: H01B1/02 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H05K3/244 , H05K2201/0341 , H05K2201/068 , Y10T428/12743 , Y10T428/1275 , Y10T428/12847 , Y10T428/12889 , Y10T428/12896 , Y10T428/1291 , H01L2924/00
Abstract: The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability of electronic packages. The slip layer substrate comprises: a base material; a first metallization layer formed on the base material; a first diffusion barrier layer formed on the first metallization layer; a slip layer formed on the first diffusion barrier layer; a second diffusion barrier layer formed on the slip layer; and a second metallization layer formed on the second diffusion barrier layer.
Abstract translation: 本发明提供了一种滑动层基材，其可以降低由它们的热膨胀失配引起的组分之间的热残余应力，从而大大提高电子封装的可靠性。 滑动层基材包括：基材; 形成在基材上的第一金属化层; 形成在第一金属化层上的第一扩散阻挡层; 形成在第一扩散阻挡层上的滑移层; 形成在滑动层上的第二扩散阻挡层; 以及形成在第二扩散阻挡层上的第二金属化层。
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公开(公告)号：USD803795S1
公开(公告)日：2017-11-28
申请号：US29573689
申请日：2016-08-09
Applicant: RSM Electron Power, Inc.
Designer： Ching Au , David Peng , Dennis Zegzula
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公开(公告)号：US09392713B2
公开(公告)日：2016-07-12
申请号：US14573631
申请日：2014-12-17
Applicant: RSM Electron Power, Inc.
Inventor： Ching Au , Dennis Zegzula , David Peng
CPC classification number: H05K5/066 , H01L23/043 , H01L23/055 , H01L23/10 , H01L2224/48091 , H01L2224/48472 , H01L2224/49111 , H05K1/0271 , H05K1/03 , H05K1/09 , H05K1/181 , H05K5/03 , H01L2924/00014
Abstract: A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically insulating substrate has a plurality of apertures and an aspect ratio of about 10:1 or greater. The plurality of electrically and thermally conductive tabs is hermetically joined to a bottom surface of the electrically insulating substrate and at least one tab covers each of the apertures. The lid is hermetically joined to a top surface of the electrically insulating substrate proximate to a perimeter of the electrically insulating substrate.
Abstract translation: 密封封装具有电绝缘基板，多个导热导电突片和盖子。 电绝缘基板具有多个孔径和约10:1或更大的纵横比。 多个导电和导热突出部气密地连接到电绝缘基底的底表面，并且至少一个突片覆盖每个孔。 盖子紧密地接合到电绝缘基板的顶表面，靠近电绝缘基板的周边。
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4.发明申请LIGHT EMITTING DIODE (LED) ASSEMBLY AND FLEXIBLE CIRCUIT BOARD WITH IMPROVED THERMAL CONDUCTIVITY 有权发光二极管（LED）组装和灵活电路板具有改善的导热性公开(公告)号：US20160095200A1
公开(公告)日：2016-03-31
申请号：US14510299
申请日：2014-10-09
Applicant: RSM Electron Power, Inc.
Inventor： Ching Au
CPC classification number: H05K1/189 , F21V29/74 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H05K1/0206 , H05K2201/066 , H05K2201/10106
Abstract: A flexible circuit board includes an electrically insulating top sheet and an electrically insulating bottom sheet. A plurality of conductive traces is positioned between the electrically insulating top and bottom sheets. A first conductive trace has a first contact pad, and a second conductive trace has a second contact pad. The first and second contact pads are exposed through at least one opening in the electrically insulating top sheet, and each of the first and second contact pads are configured to be connected to an LED. A third contact pad is exposed through openings in the electrically insulating top and bottom sheets, with a top surface of the third contact pad configured to be connected to the LED and a bottom surface of the third contact pad configured to be connected to a heat diffusion device.
Abstract translation: 柔性电路板包括电绝缘顶片和电绝缘底片。 多个导电迹线位于电绝缘的顶部和底部片之间。 第一导电迹线具有第一接触焊盘，并且第二导电迹线具有第二接触焊盘。 第一和第二接触焊盘通过电绝缘顶片中的至少一个开口露出，并且第一和第二接触焊盘中的每一个被配置为连接到LED。 第三接触垫通过电绝缘的顶部和底部片材中的开口暴露，其中第三接触焊盘的顶表面被配置为连接到LED并且第三接触焊盘的底表面被配置为连接到热扩散 设备。
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公开(公告)号：USD803796S1
公开(公告)日：2017-11-28
申请号：US29573694
申请日：2016-08-09
Applicant: RSM Electron Power, Inc.
Designer： Ching Au , David Peng , Dennis Zegzula
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Patent Agency Ranking
公开(公告)号：US20150237724A1
公开(公告)日：2015-08-20
申请号：US14183492
申请日：2014-02-18
Applicant: RSM Electron Power, Inc.
Inventor： Ching Au , Manhong Zhao , Robert Conte
CPC classification number: H01B1/02 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H05K3/244 , H05K2201/0341 , H05K2201/068 , Y10T428/12743 , Y10T428/1275 , Y10T428/12847 , Y10T428/12889 , Y10T428/12896 , Y10T428/1291 , H01L2924/00
Abstract: The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability of electronic packages. The slip layer substrate comprises: a base material; a first metallization layer formed on the base material; a first diffusion barrier layer formed on the first metallization layer; a slip layer formed on the first diffusion barrier layer; a second diffusion barrier layer formed on the slip layer; and a second metallization layer formed on the second diffusion barrier layer.
Abstract translation: 本发明提供了一种滑动层基材，其可以降低由它们的热膨胀失配引起的组分之间的热残余应力，从而大大提高电子封装的可靠性。 滑动层基材包括：基材; 形成在基材上的第一金属化层; 形成在第一金属化层上的第一扩散阻挡层; 形成在第一扩散阻挡层上的滑移层; 形成在滑动层上的第二扩散阻挡层; 以及形成在第二扩散阻挡层上的第二金属化层。
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公开(公告)号：USD803798S1
公开(公告)日：2017-11-28
申请号：US29573701
申请日：2016-08-09
Applicant: RSM Electron Power, Inc.
Designer： Ching Au , David Peng , Dennis Zegzula
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公开(公告)号：USD803797S1
公开(公告)日：2017-11-28
申请号：US29573697
申请日：2016-08-09
Applicant: RSM Electron Power, Inc.
Designer： Ching Au , David Peng , Dennis Zegzula
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9.发明授权公开(公告)号：US09648750B2
公开(公告)日：2017-05-09
申请号：US14510299
申请日：2014-10-09
Applicant: RSM Electron Power, Inc.
Inventor： Ching Au
IPC: F21V19/00 , H05K1/18 , H05K1/02 , F21V29/74 , F21Y101/00 , F21Y105/10 , F21Y115/10
CPC classification number: H05K1/189 , F21V29/74 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H05K1/0206 , H05K2201/066 , H05K2201/10106
Abstract: A flexible circuit board includes an electrically insulating top sheet and an electrically insulating bottom sheet. A plurality of conductive traces is positioned between the electrically insulating top and bottom sheets. A first conductive trace has a first contact pad, and a second conductive trace has a second contact pad. The first and second contact pads are exposed through at least one opening in the electrically insulating top sheet, and each of the first and second contact pads are configured to be connected to an LED. A third contact pad is exposed through openings in the electrically insulating top and bottom sheets, with a top surface of the third contact pad configured to be connected to the LED and a bottom surface of the third contact pad configured to be connected to a heat diffusion device.
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公开(公告)号：US20160113138A1
公开(公告)日：2016-04-21
申请号：US14573631
申请日：2014-12-17
Applicant: RSM Electron Power, Inc.
Inventor： Ching Au , Dennis Zegzula , David Peng
CPC classification number: H05K5/066 , H01L23/043 , H01L23/055 , H01L23/10 , H01L2224/48091 , H01L2224/48472 , H01L2224/49111 , H05K1/0271 , H05K1/03 , H05K1/09 , H05K1/181 , H05K5/03 , H01L2924/00014
Abstract: A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically insulating substrate has a plurality of apertures and an aspect ratio of about 10:1 or greater. The plurality of electrically and thermally conductive tabs is hermetically joined to a bottom surface of the electrically insulating substrate and at least one tab covers each of the apertures. The lid is hermetically joined to a top surface of the electrically insulating substrate proximate to a perimeter of the electrically insulating substrate.
Abstract translation: 密封封装具有电绝缘基板，多个导热导电突片和盖子。 电绝缘基板具有多个孔径和约10:1或更大的纵横比。 多个导电和导热突出部气密地连接到电绝缘基底的底表面，并且至少一个突片覆盖每个孔。 盖子紧密地接合到电绝缘基板的顶表面，靠近电绝缘基板的周边。
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