Invention Grant
- Patent Title: Removal of selected portions of protective coatings from substrates
- Patent Title (中): 从基材中去除保护涂层的选定部分
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Application No.: US14157743Application Date: 2014-01-17
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Publication No.: US09403236B2Publication Date: 2016-08-02
- Inventor: David James Astle , Tyler Christensen Child , Vimal Kumar Kasagani , Cameron LaMar Loose , Blake LeRoy Stevens , Max Ernest Sorenson
- Applicant: HzO, Inc.
- Applicant Address: US UT Draper
- Assignee: HZO, Inc.
- Current Assignee: HZO, Inc.
- Current Assignee Address: US UT Draper
- Agency: Foley Hoag LLP
- Agent Rajesh Vallabh
- Main IPC: H05K3/28
- IPC: H05K3/28 ; B23K26/36 ; C23C14/04 ; C23C16/04 ; H01L21/56 ; B23K26/40 ; H01L23/31
Abstract:
A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.
Public/Granted literature
- US20140190931A1 REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES Public/Granted day:2014-07-10
Information query
