Invention Grant
- Patent Title: Semiconductor structure with stress-reducing buffer structure
- Patent Title (中): 具有减压缓冲结构的半导体结构
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Application No.: US14628281Application Date: 2015-02-22
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Publication No.: US09412902B2Publication Date: 2016-08-09
- Inventor: Maxim S. Shatalov , Jinwei Yang , Alexander Dobrinsky , Michael Shur , Remigijus Gaska
- Applicant: Sensor Electronic Technology, Inc.
- Applicant Address: US SC Columbia
- Assignee: Sensor Electronic Technology, Inc.
- Current Assignee: Sensor Electronic Technology, Inc.
- Current Assignee Address: US SC Columbia
- Agency: LaBatt, LLC
- Main IPC: H01L33/12
- IPC: H01L33/12 ; H01L33/00 ; H01L33/24 ; H01L33/06 ; H01L33/32

Abstract:
A semiconductor structure comprising a buffer structure and a set of semiconductor layers formed adjacent to a first side of the buffer structure is provided. The buffer structure can have an effective lattice constant and a thickness such that an overall stress in the set of semiconductor layers at room temperature is compressive and is in a range between approximately 0.1 GPa and 2.0 GPa. The buffer structure can be grown using a set of growth parameters selected to achieve the target effective lattice constant a, control stresses present during growth of the buffer structure, and/or control stresses present after the semiconductor structure has cooled.
Public/Granted literature
- US20150243841A1 Semiconductor Structure with Stress-Reducing Buffer Structure Public/Granted day:2015-08-27
Information query
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