Invention Grant
- Patent Title: Contactless interconnect
- Patent Title (中): 非接触式互连
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Application No.: US13495325Application Date: 2012-06-13
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Publication No.: US09431168B2Publication Date: 2016-08-30
- Inventor: Jean-Philippe Fricker
- Applicant: Jean-Philippe Fricker
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Main IPC: H01F38/00
- IPC: H01F38/00 ; H01F38/14 ; H04B5/00

Abstract:
A contactless connector requires no physical contact. A terminated transmitting transmission line on a first board is parallel to a dual-terminated receiving transmission line on a second board. The boards are placed face-to-face with a small air gap in-between. A driver drives a driven pulse onto a first end of the transmitting transmission line. The driven pulse capacitively induces a positive induced pulse on the first end of the receiving transmission line. As the driven pulse travels from the first end to the second end of the transmitting transmission line, energy is transferred to the induced pulse, which travels down the receiving transmission line. Inductive coupling becomes stronger than capacitive as the length increases, so that at the second end, the induced pulse is negative and then swings positive. A Schmitt trigger receiver on the second end of the receiving transmission line detects the signal.
Public/Granted literature
- US20130334890A1 Contactless Interconnect Public/Granted day:2013-12-19
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