Invention Grant
US09433078B2 Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission
有权
具有嵌入式电光无源元件的印刷电路板,用于更高带宽传输
- Patent Title: Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission
- Patent Title (中): 具有嵌入式电光无源元件的印刷电路板,用于更高带宽传输
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Application No.: US13673986Application Date: 2012-11-09
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Publication No.: US09433078B2Publication Date: 2016-08-30
- Inventor: Vladimir Duvanenko
- Applicant: SANMINA CORPORATION
- Applicant Address: US CA San Jose
- Assignee: SANMINA CORPORATION
- Current Assignee: SANMINA CORPORATION
- Current Assignee Address: US CA San Jose
- Agency: Loza & Loza, LLP
- Agent Julio M. Loza
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/02 ; H05K1/18 ; H05K3/00 ; H05K1/11

Abstract:
A printed circuit board (PCB) is provided comprising a plurality of non-conductive layers with conductive or signal layers in between. The PCB includes a first conductive via traversing the plurality of non-conductive and conductive or signal layers as well as a second conductive via traversing the plurality of non-conductive layers and conductive or signal layers, the second conductive via located substantially parallel to the first conductive via. An embedded electro-optical passive element is also provided that extends perpendicular to and between the first conductive via and the second conductive via. The electro-optical passive element embedded is located within a selected layer at a first depth in the printed circuit board, wherein such first depth is selected to reflect an incident electromagnetic wave back into the printed circuit board to enhance or diminish an electrical signal in the first conductive via by creating a positive or negative electromagnetic interference.
Public/Granted literature
- US20130112465A1 PRINTED CIRCUIT BOARDS WITH EMBEDDED ELECTRO-OPTICAL PASSIVE ELEMENT FOR HIGHER BANDWIDTH TRANSMISSION Public/Granted day:2013-05-09
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