Invention Grant
- Patent Title: Wiring conduit
- Patent Title (中): 接线管
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Application No.: US13904423Application Date: 2013-05-29
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Publication No.: US09438016B1Publication Date: 2016-09-06
- Inventor: Alfredo Z. Campos
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Toler Law Group, PC
- Main IPC: B60L1/00
- IPC: B60L1/00 ; B60L3/00 ; H02G3/00 ; H02G3/04 ; H02G1/00

Abstract:
In one embodiment a wiring conduit comprises a body having a length extending along a longitudinal axis, the body comprising a plurality of interconnected sections defined by cutouts which extend through a portion of the body, wherein at least a portion of the body is removed along the longitudinal axis to define an opening extending along the length of the body. Other embodiments may be described.
Information query
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