Invention Grant
- Patent Title: Method for manufacturing printed circuit board
- Patent Title (中): 印刷电路板制造方法
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Application No.: US13949237Application Date: 2013-07-24
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Publication No.: US09439282B2Publication Date: 2016-09-06
- Inventor: Wen-Hung Hu
- Applicant: Zhen Ding Technology Co., Ltd.
- Applicant Address: TW Tayuan, Taoyuan
- Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee Address: TW Tayuan, Taoyuan
- Agent Zhigang Ma
- Priority: CN2012103630827 20120926
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/02 ; H05K3/00 ; H01L23/13 ; H01L21/48 ; H05K1/18 ; H05K3/46

Abstract:
A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion.
Public/Granted literature
- US20140083744A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME Public/Granted day:2014-03-27
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