公开(公告)号：US09439282B2

公开(公告)日：2016-09-06

申请号：US13949237

申请日：2013-07-24

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Wen-Hung Hu

IPC: H05K1/09 ,  H05K1/02 ,  H05K3/00 ,  H01L23/13 ,  H01L21/48 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L21/4857 ,  H01L23/13 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/0058 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09127 ,  H01L2924/00

Abstract: A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion.

Abstract translation: 印刷电路板包括依次布置的第一迹线层，第一介电层，第二迹线层，第二介电层，第三迹线层，第三介电层和第四迹线层。 在从第四迹线层延伸到第二介电层的印刷电路板中限定空腔。 第二电介质层的一部分暴露在空腔中。 与第二电介质层组合的第四迹线层的表面和与第一介电层结合的第二迹线层的表面都被粗糙化以增加粘合强度。

公开(公告)号：US09439281B2

公开(公告)日：2016-09-06

申请号：US13947114

申请日：2013-07-22

Applicant: Zhen Ding Technology Co., LTd.

Inventor： Wen-Hung Hu

IPC: H05K1/09 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/18 ,  H05K3/42

CPC classification number: H05K1/0296 ,  H05K3/007 ,  H05K3/185 ,  H05K3/422 ,  H05K3/4661 ,  H05K2203/107

Abstract: A printed circuit board includes a base, a number of conductive pads, a dielectric layer, an activated metal layer, a first metal seed layer, a second metal seed layer, and a plurality of metal bumps. The conductive pads are formed on the base. The dielectric layer is formed on a surface of the conductive pads and portions of the base are exposed from the conductive pads. The dielectric layer includes blind vias corresponding to the conductive pads, and a laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the dielectric layer. The second metal seed layer is formed on the activated metal layer and the conductive pads. Each metal bump is formed on the second metal seed layer, and each metal bump protrudes from the dielectric layer.

Abstract translation: 印刷电路板包括基底，多个导电垫，电介质层，活化金属层，第一金属种子层，第二金属籽晶层和多个金属凸块。 导电垫形成在基座上。 电介质层形成在导电焊盘的表面上，并且基底的部分从导电焊盘露出。 电介质层包括对应于导电焊盘的盲孔和激光活化催化剂。 激活的金属层通过激光照射在盲孔的壁处获得。 活化金属层与电介质层接触。 第二金属种子层形成在活化的金属层和导电垫上。 每个金属凸块形成在第二金属种子层上，并且每个金属凸块从电介质层突出。

公开(公告)号：US09295150B2

公开(公告)日：2016-03-22

申请号：US14035957

申请日：2013-09-25

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Wen-Hung Hu

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/42 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/115 ,  H05K3/421 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49165

Abstract: A printed circuit board includes a first, second, and third dielectric layers, and a first, second, and third trace layers. The first trace layer and the second trace layer are formed on opposite surfaces of the first dielectric layer. The second dielectric layer is formed on the second trace layer, a first blind hole is defined in the first surface and terminated at a position in the first dielectric layer, a first conductive via is formed in the first blind hole. A second blind hole is formed in the second dielectric layer and the first dielectric layer. A second conductive via is formed in the second blind hole. The third trace layer is electrically connected with the second conductive via. The first trace layer is electrically connected with the second trace layer through the first conductive via and the second conductive via.

Abstract translation: 印刷电路板包括第一，第二和第三电介质层，以及第一，第二和第三迹线层。 第一迹线层和第二迹线层形成在第一介电层的相对表面上。 第二电介质层形成在第二迹线层上，第一盲孔被限定在第一表面中并且终止于第一电介质层中的位置，第一导电通孔形成在第一盲孔中。 在第二电介质层和第一电介质层中形成第二盲孔。 第二导电通孔形成在第二盲孔中。 第三迹线层与第二导电通孔电连接。 第一迹线层通过第一导电通孔和第二导电通孔与第二迹线层电连接。

公开(公告)号：US09107332B2

公开(公告)日：2015-08-11

申请号：US13864232

申请日：2013-04-16

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Wen-Hung Hu

IPC: H05K1/09 ,  H05K3/34 ,  H05K3/40 ,  H05K3/24 ,  H05K3/42

CPC classification number: H05K3/3452 ,  H05K3/244 ,  H05K3/4007 ,  H05K3/4046 ,  H05K3/428 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/099 ,  H05K2203/0571 ,  H05K2203/0577 ,  H05K2203/1383 ,  Y10T29/49167

Abstract: A printed circuit board includes a base, a circuit pattern, a solder mask, an activated metal layer, a plurality of metal seed layers, and a plurality of metal bumps. The conductive circuit pattern is formed on the base, to include a plurality of conductive pads. The solder mask is formed on a surface of the conductive circuit pattern and portions of the base are exposed from the circuit pattern. The solder mask includes blind vias corresponding to the pads, and laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the solder mask. The metal seed layer is formed on the activated metal layer and the pads. Each metal bump is formed on the metal seed layer, and each metal bump protrudes from the solder mask.

Abstract translation: 印刷电路板包括基底，电路图案，焊接掩模，活化金属层，多个金属种子层和多个金属凸块。 导电电路图案形成在基底上，以包括多个导电焊盘。 焊接掩模形成在导电电路图案的表面上，并且基底的部分从电路图案露出。 焊接掩模包括对应于焊盘的盲孔和激光活化催化剂。 激活的金属层通过激光照射在盲孔的壁处获得。 活化的金属层与焊料掩模接触。 在活化的金属层和焊盘上形成金属种子层。 每个金属凸块形成在金属种子层上，并且每个金属凸块从焊接掩模突出。