Invention Grant
US09439292B1 Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure
有权
用于制造具有高密度引脚数的埋入元件的电路板和电路板结构的方法
- Patent Title: Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure
- Patent Title (中): 用于制造具有高密度引脚数的埋入元件的电路板和电路板结构的方法
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Application No.: US14641016Application Date: 2015-03-06
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Publication No.: US09439292B1Publication Date: 2016-09-06
- Inventor: Ting-Hao Lin , Yi-Fan Kao , Jaen-Don Lan , Yung-Lin Chia , An-Ping Tseng
- Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
- Applicant Address: TW Taoyuan
- Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
- Current Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
- Current Assignee Address: TW Taoyuan
- Agency: Lin & Associates Intellectual Property, Inc.
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/06 ; H05K3/00
Abstract:
A method for manufacturing a circuit board with a buried element having high density pin count, wherein a micro copper window formed in a first circuit by patterned dry film electroplating is easily controlled less than 50 μm so that the micro conduction holes formed after the laser drilling each has a diameter greatly shrunk less than 50 μm so as to highly increase density of the micro conduction holes, thereby facilitating in burial of the buried element with the high density pin count. Additionally, by disposing the micro conduction holes in the same elevation, optically aligning a fixing position for the buried element can be controlled precisely.
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