A multilayer electronic support structure comprising at least one pair of adjacent feature layers extending in an X-Y plane that are separated by a via layer; said via layer comprising a dielectric material that is sandwiched between the two adjacent feature layers and at least one one non-cylindrical via post that couples said pair of adjacent feature layers through the dielectric material in a Z direction perpendicular to the X-Y plane; wherein said at least one non-cylindrical via post is characterized by having a long dimension in the X-Y plane that is at least 3 times as long as a short dimension in the X-Y plane.