Invention Grant
- Patent Title: Touch sensing circuit and method for making the same
- Patent Title (中): 触摸感应电路及其制作方法
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Application No.: US13077974Application Date: 2011-03-31
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Publication No.: US09454267B2Publication Date: 2016-09-27
- Inventor: Kwan-Sin Ho , Pingping Huang , Jianbin Yan , Hao Zhang , Zhixiong Cai , Tiefei Xiao
- Applicant: Kwan-Sin Ho , Pingping Huang , Jianbin Yan , Hao Zhang , Zhixiong Cai , Tiefei Xiao
- Applicant Address: CN Xiamen
- Assignee: TPK TOUCH SOLUTIONS (XIAMEN) INC.
- Current Assignee: TPK TOUCH SOLUTIONS (XIAMEN) INC.
- Current Assignee Address: CN Xiamen
- Agency: Cooper Legal Group, LLC
- Priority: CN201010204628 20100612
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044
Abstract:
The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 Å-500 Å; a conductive layer having a thickness of 1000 Å-5000 Å; and an insulating layer having a thickness of 1 μm-5 μm disposed between the transparent conductive layer and the conductive layer.
Public/Granted literature
- US20110304582A1 TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME Public/Granted day:2011-12-15
Information query
