Invention Grant
- Patent Title: Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same
- Patent Title (中): 临时粘结粘合剂组合物和使用其的半导体器件的制造方法
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Application No.: US14334265Application Date: 2014-07-17
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Publication No.: US09458365B2Publication Date: 2016-10-04
- Inventor: Tae-Hoon Kim , Hideto Kato , Jae-Hyun Kim , Jun-Won Han , Hiroyuki Yasuda , Shohei Tagami , Michihiro Sugo , Jung-Sik Choi
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2013-0085832 20130722
- Main IPC: C09J183/04
- IPC: C09J183/04 ; C09J183/06 ; C08G77/00 ; C08G77/52 ; B32B27/28 ; H01L21/683 ; H01L25/065 ; H01L25/00 ; B05D3/02
Abstract:
A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.
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