Invention Grant
- Patent Title: Packaging substrate having a through-holed interposer
- Patent Title (中): 具有通孔插入器的封装基板
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Application No.: US14641901Application Date: 2015-03-09
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Publication No.: US09460992B2Publication Date: 2016-10-04
- Inventor: Tzyy-Jang Tseng , Dyi-Chung Hu , Ying-Chih Chan
- Applicant: Unimicron Technology Corporation
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Priority: TW101126991A 20120726
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/48 ; H01L21/768 ; H01L21/56 ; H01L23/31 ; H01L21/48 ; H05K1/11 ; H01L25/065 ; H01L23/00
Abstract:
A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.
Public/Granted literature
- US20150187692A1 PACKAGING SUBSTRATE HAVING A THROUGH-HOLED INTERPOSER Public/Granted day:2015-07-02
Information query
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