Invention Grant
US09473459B2 Peel ply, method of surface preparation and bonding composite structures using the same
有权
剥离层,表面处理方法和使用该复合结构的复合结构
- Patent Title: Peel ply, method of surface preparation and bonding composite structures using the same
- Patent Title (中): 剥离层,表面处理方法和使用该复合结构的复合结构
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Application No.: US13678595Application Date: 2012-11-16
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Publication No.: US09473459B2Publication Date: 2016-10-18
- Inventor: Yiqiang Zhao , Dalip Kumar Kohli , Kunal Gaurang Shah
- Applicant: Cytec Technology Corp.
- Applicant Address: US DE Wilmington
- Assignee: Cytec Technology Corp.
- Current Assignee: Cytec Technology Corp.
- Current Assignee Address: US DE Wilmington
- Agent Thi D. Dang
- Main IPC: C09J7/04
- IPC: C09J7/04 ; B32B37/16 ; H04L29/06 ; H04W12/06 ; H04W12/08 ; H04W4/00 ; G06F9/445 ; G06F9/455 ; G06F3/0482 ; G06F3/0484 ; H04M1/725 ; H04W76/02 ; H04L12/24 ; H04W68/12

Abstract:
A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.
Public/Granted literature
- US20130129957A1 Peel Ply, Method of Surface Preparation and Bonding Composite Structures Using the Same Public/Granted day:2013-05-23
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