A low profile strip dual in-line memory module (200) includes a passive interposer support structure (90) with patterned openings (91-97) formed between opposing top and bottom surfaces, a plurality of memory chips (D1-D8) attached to the top and bottom surfaces, and vertical solder ball conductors (98) extending through the patterned openings to electrically connect the plurality of memory chips, where each memory chip has an attachment surface facing the passive interposer structure and a patterned array of horizontal conductors (e.g., 82-86) formed on the attachment surface with contact pads electrically connected to the plurality of vertical conductors to define at least one bus conductor that is electrically connected to each memory die in the first and second plurality of memory die.