Invention Grant
- Patent Title: Selective splitting of high order silanes
- Patent Title (中): 选择性分裂高阶硅烷
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Application No.: US13884473Application Date: 2011-10-24
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Publication No.: US09481580B2Publication Date: 2016-11-01
- Inventor: Ekkehard Mueh , Hartwig Rauleder
- Applicant: Ekkehard Mueh , Hartwig Rauleder
- Applicant Address: DE Essen
- Assignee: Evonik Degussa GmbH
- Current Assignee: Evonik Degussa GmbH
- Current Assignee Address: DE Essen
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: DE102010043648 20101109
- International Application: PCT/EP2011/068534 WO 20111024
- International Announcement: WO2012/062560 WO 20120518
- Main IPC: C01B33/107
- IPC: C01B33/107 ; C01B33/04 ; C01B33/08 ; B01J37/06 ; B01J21/08 ; B01J37/02

Abstract:
The invention relates to a process for preparing monomeric and/or dimeric halogen- and/or hydrogen-containing silicon compounds from oligomeric inorganic silanes having three or more directly covalently interconnected silicon atoms substituted by substituents selected from halogen, hydrogen and/or oxygen by reacting the oligomeric silane over a nitrogen-containing catalyst in the presence of hydrogen halide.
Public/Granted literature
- US20130294995A1 SELECTIVE SPLITTING OF HIGH ORDER SILANES Public/Granted day:2013-11-07
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