Invention Grant
US09488911B2 Photosensitive composition, photocurable composition, chemical amplification resist composition, resist film, pattern forming method, method of manufacturing electronic device and electronic device
有权
光敏组合物，光固化组合物，化学增幅抗蚀剂组合物，抗蚀剂膜，图案形成方法，电子器件和电子器件的制造方法
- Patent Title: Photosensitive composition, photocurable composition, chemical amplification resist composition, resist film, pattern forming method, method of manufacturing electronic device and electronic device
- Patent Title (中): 光敏组合物，光固化组合物，化学增幅抗蚀剂组合物，抗蚀剂膜，图案形成方法，电子器件和电子器件的制造方法
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Application No.: US14831801Application Date: 2015-08-20
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Publication No.: US09488911B2Publication Date: 2016-11-08
- Inventor: Tomotaka Tsuchimura , Kyouhei Sakita
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Jianq Chyun IP Office
- Priority: JP2013-032585 20130221
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/20 ; G03F7/32 ; G03F7/039 ; G03F7/038 ; C07D277/64 ; C07D277/84 ; C07D413/12
Abstract:
There is provided a photosensitive composition containing a compound represented by Formula (I), and the Formula (I) is defined as herein, and chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and a chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation.
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Information query
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