Invention Grant
US09508558B2 Wafer treatment solution for edge-bead removal, edge film hump reduction and resist surface smooth, its apparatus and edge-bead removal method by using the same
有权
用于边缘珠去除的晶片处理溶液，边缘膜隆起还原和抗蚀剂表面光滑，其装置和边缘珠去除方法使用相同
- Patent Title: Wafer treatment solution for edge-bead removal, edge film hump reduction and resist surface smooth, its apparatus and edge-bead removal method by using the same
- Patent Title (中): 用于边缘珠去除的晶片处理溶液，边缘膜隆起还原和抗蚀剂表面光滑，其装置和边缘珠去除方法使用相同
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Application No.: US14591044Application Date: 2015-01-07
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Publication No.: US09508558B2Publication Date: 2016-11-29
- Inventor: Yu-Hsun Lin
- Applicant: I-Shan Ke
- Applicant Address: TW New Taipei
- Assignee: I-Shan Ke
- Current Assignee: I-Shan Ke
- Current Assignee Address: TW New Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW103129216A 20140825
- Main IPC: C11D7/50
- IPC: C11D7/50 ; H01L21/306 ; H01L21/308 ; C11D11/00 ; H01L21/67
Abstract:
The present disclosure provides a wafer treatment solution for edge-bead removal, edge film hump reduction and resist surface smooth. The wafer treatment solution includes a solution and a fluorine-containing additive mixed in the solution. The fluorine-containing additive has a following formula (I): Rf—X—(CH2CH2O)m—R1 (I); or a following formula (II): An apparatus and a method by using the wafer treatment solution are also provided herein.
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