Invention Grant
- Patent Title: Flexible substrate
- Patent Title (中): 柔性基材
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Application No.: US14642945Application Date: 2015-03-10
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Publication No.: US09510441B2Publication Date: 2016-11-29
- Inventor: Chin-Tang Hsieh , Fei-Jain Wu , Chia-Jung Tu
- Applicant: CHIPBOND TECHNOLOGY CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: CHIPBOND TECHNOLOGY CORPORATION
- Current Assignee: CHIPBOND TECHNOLOGY CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Jackson IPG PLLC
- Agent Demian K. Jackson
- Priority: TW104103978A 20150205
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/03
Abstract:
A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.
Public/Granted literature
- US20160234927A1 FLEXIBLE SUBSTRATE Public/Granted day:2016-08-11
Information query
