Invention Grant
- Patent Title: Circuit module system
- Patent Title (中): 电路模块系统
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Application No.: US14583145Application Date: 2014-12-25
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Publication No.: US09516756B2Publication Date: 2016-12-06
- Inventor: Sheng-Che Huang , Yu-Tse Liu , Wei-Han Hu , Chien-Hung Lee
- Applicant: EZEK LAB COMPANY LIMITED
- Applicant Address: TW Taipei
- Assignee: EZEK LAB COMPANY LIMITED
- Current Assignee: EZEK LAB COMPANY LIMITED
- Current Assignee Address: TW Taipei
- Agent Chun-Ming Shih
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H01R12/71

Abstract:
A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes a first base connected to a side of the first circuit board and at least one first conductor. A top surface of the first base forms a fillister connecting to outside, the first conductor is clamped on the first base and electrically connects the first circuit board to outside. The second circuit module includes a second circuit board and a second connecting housing, the second connecting housing includes a second base connected to a side of the second circuit board and at least one second conductor. A protruding part protrudes from an outer side of the second base, the second conductor is clamped on the second base and electrically connects the second circuit board to outside.
Public/Granted literature
- US20160192492A1 CIRCUIT MODULE SYSTEM Public/Granted day:2016-06-30
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