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公开(公告)号：US20160192492A1
公开(公告)日：2016-06-30
申请号：US14583145
申请日：2014-12-25
Applicant: EZEK LAB COMPANY LIMITED
Inventor： Sheng-Che Huang , Yu-Tse Liu , Wei-Han Hu , Chien-Hung Lee
CPC classification number: H05K1/144 , H01R9/2408 , H01R9/2458 , H01R12/718 , H01R12/732 , H05K1/142 , H05K1/184 , H05K2201/10189 , H05K2201/2072 , H05K2201/209
Abstract: A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes a first base connected to a side of the first circuit board and at least one first conductor. A top surface of the first base forms a fillister connecting to outside, the first conductor is clamped on the first base and electrically connects the first circuit board to outside. The second circuit module includes a second circuit board and a second connecting housing, the second connecting housing includes a second base connected to a side of the second circuit board and at least one second conductor. A protruding part protrudes from an outer side of the second base, the second conductor is clamped on the second base and electrically connects the second circuit board to outside.
Abstract translation: 电路模块系统包括第一和第二电路模块，第一电路模块包括第一电路板和第一连接壳体，第一连接壳体包括连接到第一电路板一侧的第一基座和至少一个第一电路板 导体。 第一基座的顶表面形成连接到外部的填充器，第一导体夹在第一基座上并将第一电路板电连接到外部。 第二电路模块包括第二电路板和第二连接壳体，第二连接壳体包括连接到第二电路板侧面的第二基座和至少一个第二导体。 突出部分从第二基座的外侧突出，第二导体被夹紧在第二基座上并将第二电路板电连接到外部。
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公开(公告)号：US09516756B2
公开(公告)日：2016-12-06
申请号：US14583145
申请日：2014-12-25
Applicant: EZEK LAB COMPANY LIMITED
Inventor： Sheng-Che Huang , Yu-Tse Liu , Wei-Han Hu , Chien-Hung Lee
CPC classification number: H05K1/144 , H01R9/2408 , H01R9/2458 , H01R12/718 , H01R12/732 , H05K1/142 , H05K1/184 , H05K2201/10189 , H05K2201/2072 , H05K2201/209
Abstract: A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes a first base connected to a side of the first circuit board and at least one first conductor. A top surface of the first base forms a fillister connecting to outside, the first conductor is clamped on the first base and electrically connects the first circuit board to outside. The second circuit module includes a second circuit board and a second connecting housing, the second connecting housing includes a second base connected to a side of the second circuit board and at least one second conductor. A protruding part protrudes from an outer side of the second base, the second conductor is clamped on the second base and electrically connects the second circuit board to outside.
Abstract translation: 电路模块系统包括第一和第二电路模块，第一电路模块包括第一电路板和第一连接壳体，第一连接壳体包括连接到第一电路板一侧的第一基座和至少一个第一电路板 导体。 第一基座的顶表面形成连接到外部的填充器，第一导体夹在第一基座上并将第一电路板电连接到外部。 第二电路模块包括第二电路板和第二连接壳体，第二连接壳体包括连接到第二电路板侧面的第二基座和至少一个第二导体。 突出部分从第二基座的外侧突出，第二导体被夹紧在第二基座上并将第二电路板电连接到外部。
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