A printed circuit board (PCB) is provided. From top to bottom, the PCB sequentially includes: a top layer; an upper solder resist layer; a wiring layer; a lower solder resist layer; a bottom layer; and a hole installation part disposed on the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer. Wherein, the hole installation part includes a screw hole and a copper exposing region; a copper foil is disposed on the copper exposing region of the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer; an area of the copper foil is not less than an area of the copper exposing region.