Invention Grant
- Patent Title: Providing a serial protocol for a bidirectional serial interconnect
- Patent Title (中): 为双向串行互连提供串行协议
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Application No.: US14558942Application Date: 2014-12-03
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Publication No.: US09524265B2Publication Date: 2016-12-20
- Inventor: David J. Harriman , Jeff C. Morriss
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G08C25/00 ; G06F11/08 ; H04L1/00 ; G06F1/12
Abstract:
In one embodiment, the present invention includes a host controller with transmit logic to prepare data into a packet for communication along an interconnect and to transmit the packet. This packet may include a preamble portion having a first predetermined value, a content portion including the data and having a plurality of symbols each including a start bit separate from the data, an error detection portion including an inverted version of the content portion, and a postamble portion having a second predetermined value. Other embodiments are described and claimed.
Public/Granted literature
- US20150089107A1 Providing A Serial Protocol For A Bidirectional Serial Interconnect Public/Granted day:2015-03-26
Information query
