Invention Grant
- Patent Title: Infrared sensor package
- Patent Title (中): 红外传感器封装
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Application No.: US14699112Application Date: 2015-04-29
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Publication No.: US09534959B2Publication Date: 2017-01-03
- Inventor: Luc Buydens , Sam Maddalena
- Applicant: Melexis Techologies NV
- Applicant Address: BE Tessenderlo
- Assignee: MELEXIS TECHNOLOGIES NV
- Current Assignee: MELEXIS TECHNOLOGIES NV
- Current Assignee Address: BE Tessenderlo
- Agency: Workman Nydegger
- Priority: GB1407477.7 20140429
- Main IPC: G01J5/02
- IPC: G01J5/02 ; G01J5/04 ; G01J5/12 ; G01J5/08 ; G01J5/20 ; H01L31/18

Abstract:
The present invention relates to an integrated infrared sensor device, comprising a sensor substrate and a filter substrate. The sensor substrate has a back surface and a front surface opposite the back surface, in which the back surface has a cavity defined therein and the front surface has at least one infrared sensing element formed therein or arranged thereon, covered with a cap for protecting the at least one sensing element, e.g. against mechanical damage and dust, and/or against stray radiation. The filter substrate is arranged on the back surface of the sensor substrate such that the filter substrate at least partially covers the cavity. The filter substrate is adapted in shape and composition to transmit infrared radiation and to attenuate radiation in at least part of the visible light spectrum.
Public/Granted literature
- US20150308899A1 Infrared Sensor Package Public/Granted day:2015-10-29
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