Invention Grant
- Patent Title: Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor device
- Patent Title (中): 反光掩模板及其制造方法,反射掩模的制造方法以及半导体装置的制造方法
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Application No.: US15179030Application Date: 2016-06-10
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Publication No.: US09535318B2Publication Date: 2017-01-03
- Inventor: Kazuhiro Hamamoto , Tatsuo Asakawa , Osamu Maruyama , Tsutomu Shoki
- Applicant: HOYA CORPORATION
- Applicant Address: JP Shinjuku-ku, Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Shinjuku-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-169897 20120731
- Main IPC: G03F1/24
- IPC: G03F1/24 ; G03F1/48

Abstract:
This invention provides a reflective mask blank capable of preventing peeling-off of a multilayer reflective film due to cleaning or the like in a mask manufacturing process or during mask use. The reflective mask blank includes a multilayer reflective film, a protective film, an absorber film, and a resist film formed in this order on a substrate. Assuming that a distance from the center of the substrate to an outer peripheral end of the multilayer reflective film is L(ML), that a distance from the center of the substrate to an outer peripheral end of the protective film is L(Cap), that a distance from the center of the substrate to an outer peripheral end of the absorber film is L(Abs), and that a distance from the center of the substrate to an outer peripheral end of the resist film is L(Res), L(Abs)>L(Res)>L(Cap)≧L(ML) and the outer peripheral end of the resist film is located inward of an outer peripheral end of the substrate.
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