Reflective mask blank, method of manufacturing reflective mask blank, reflective mask and method of manufacturing semiconductor device

    公开(公告)号:US10191365B2

    公开(公告)日:2019-01-29

    申请号:US15634247

    申请日:2017-06-27

    Abstract: A reflective mask blank capable of facilitating the discovery of contaminants, scratches and other critical defects by inhibiting the detection of pseudo defects attributable to surface roughness of a substrate or film in a defect inspection using a highly sensitive defect inspection apparatus. The reflective mask blank has a mask blank multilayer film comprising a multilayer reflective film, obtained by alternately laminating a high refractive index layer and a low refractive index layer, and an absorber film on a main surface of a mask blank substrate, wherein the root mean square roughness (Rms), obtained by measuring a 3 μm×3 μm region on the surface of the reflective mask blank on which the mask blank multilayer film is formed with an atomic force microscope, is not more than 0.5 nm and the power spectrum density at a spatial frequency of 1 μm−1 to 10 μm−1 is not more than 50 nm4.

    Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor device
    2.
    发明授权
    Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor device 有权
    反光掩模板及其制造方法,反射掩模的制造方法以及半导体装置的制造方法

    公开(公告)号:US09377679B2

    公开(公告)日:2016-06-28

    申请号:US14418629

    申请日:2013-07-27

    CPC classification number: G03F1/24 G03F1/48

    Abstract: This invention provides a reflective mask blank capable of preventing peeling-off of a multilayer reflective film due to cleaning or the like in a mask manufacturing process or during mask use. The reflective mask blank includes a multilayer reflective film, a protective film, an absorber film, and a resist film formed in this order on a substrate. Assuming that a distance from the center of the substrate to an outer peripheral end of the multilayer reflective film is L(ML), that a distance from the center of the substrate to an outer peripheral end of the protective film is L(Cap), that a distance from the center of the substrate to an outer peripheral end of the absorber film is L(Abs), and that a distance from the center of the substrate to an outer peripheral end of the resist film is L(Res), L(Abs)>L(Res)>L(Cap)≧L(ML) and the outer peripheral end of the resist film is located inward of an outer peripheral end of the substrate.

    Abstract translation: 本发明提供了一种能够防止在掩模制造工艺中或在掩模使用期间由于清洁等而剥离多层反射膜的反射掩模板。 反射掩模坯料包括在基板上依次形成的多层反射膜,保护膜,吸收膜和抗蚀剂膜。 假设从基板的中心到多层反射膜的外周端的距离为L(ML),则从基板的中心到保护膜的外周端的距离为L(Cap), 从基板的中心到吸收膜的外周端的距离为L(Abs),并且从基板的中心到抗蚀剂膜的外周端的距离为L(Res),L (Ab)> L(Res)> L(Cap)≥L(ML),并且抗蚀剂膜的外周端位于衬底的外周端的内侧。

    Reflective mask blank, method of manufacturing reflective mask blank, reflective mask and method of manufacturing semiconductor device

    公开(公告)号:US09720315B2

    公开(公告)日:2017-08-01

    申请号:US14787497

    申请日:2014-08-29

    CPC classification number: G03F1/24 G03F7/2004

    Abstract: Provided is a reflective mask blank capable of facilitating the discovery of contaminants, scratches and other critical defects by inhibiting the detection of pseudo defects attributable to surface roughness of a substrate or film in a defect inspection using a highly sensitive defect inspection apparatus. The reflective mask blank has a mask blank multilayer film comprising a multilayer reflective film, obtained by alternately laminating a high refractive index layer and a low refractive index layer, and an absorber film on a main surface of a mask blank substrate, wherein the root mean square roughness (Rms), obtained by measuring a 3 μm×3 μm region on the surface of the reflective mask blank on which the mask blank multilayer film is formed with an atomic force microscope, is not more than 0.5 nm and the power spectrum density at a spatial frequency of 1 μm−1 to 10 μm−1 is not more than 50 nm4.

    Reflective mask blank, method for manufacturing same, reflective mask, method for manufacturing same, and method for manufacturing semiconductor device

    公开(公告)号:US10347485B2

    公开(公告)日:2019-07-09

    申请号:US15508544

    申请日:2015-09-14

    Abstract: The present invention aims to provide a reflective mask blank and a reflective mask which have a highly smooth multilayer reflective film as well as a low number of defects, and methods of manufacturing the same, and aims to prevent charge-up during a mask defect inspection using electron beams.The present invention provides a reflective mask blank for EUV lithography in which a conductive underlying film, a multilayer reflective film that reflects exposure light, and an absorber film that absorbs exposure light are layered on a substrate, wherein the conductive underlying film is a single-layer film made of a tantalum-based material or a ruthenium-based material with a film thickness of greater than or equal to 1 nm and less than or equal to 10 nm that is formed adjacent to the multilayer reflective film, or the conductive underlying film is a multilayer film including a layer of a tantalum-based material with a film thickness of greater than or equal to 1 nm and less than or equal to 10 nm that is formed adjacent to the multilayer reflective film and a layer of a conductive material that is formed between the layer of the tantalum-based material and the substrate. The present invention also provides a reflective mask manufactured using the reflective mask blank. Furthermore, a semiconductor device is manufactured using the reflective mask.

    Reflective mask blank, method of manufacturing same, reflective mask and method of manufacturing semiconductor device

    公开(公告)号:US09726969B2

    公开(公告)日:2017-08-08

    申请号:US14787532

    申请日:2014-08-29

    CPC classification number: G03F1/24 G03F1/84 G03F7/2004

    Abstract: A reflective mask blank capable of facilitating the discovery of contaminants, scratches and other critical defects by inhibiting the detection of pseudo defects attributable to surface roughness of a substrate or film in a defect inspection using a highly sensitive defect inspection apparatus. The reflective mask blank has a mask blank multilayer film comprising a multilayer reflective film, obtained by alternately laminating a high refractive index layer and a low refractive index layer, and an absorber film on a main surface of a mask blank substrate, wherein, in the relationship between bearing area (%) and bearing depth (nm) as measured with an atomic force microscope for a 1 μm×1 μm region of the surface of the reflective mask blank on which the mask blank multilayer film is formed, the surface of the reflective mask blank satisfies the relationship of (BA70−BA30)/(BD70−BD30)≧60(%/nm) and maximum height (Rmax)≦4.5 nm.

    Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor device
    8.
    发明授权
    Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor device 有权
    反光掩模板及其制造方法,反射掩模的制造方法以及半导体装置的制造方法

    公开(公告)号:US09535318B2

    公开(公告)日:2017-01-03

    申请号:US15179030

    申请日:2016-06-10

    CPC classification number: G03F1/24 G03F1/48

    Abstract: This invention provides a reflective mask blank capable of preventing peeling-off of a multilayer reflective film due to cleaning or the like in a mask manufacturing process or during mask use. The reflective mask blank includes a multilayer reflective film, a protective film, an absorber film, and a resist film formed in this order on a substrate. Assuming that a distance from the center of the substrate to an outer peripheral end of the multilayer reflective film is L(ML), that a distance from the center of the substrate to an outer peripheral end of the protective film is L(Cap), that a distance from the center of the substrate to an outer peripheral end of the absorber film is L(Abs), and that a distance from the center of the substrate to an outer peripheral end of the resist film is L(Res), L(Abs)>L(Res)>L(Cap)≧L(ML) and the outer peripheral end of the resist film is located inward of an outer peripheral end of the substrate.

    Abstract translation: 本发明提供了一种能够防止在掩模制造工艺中或在掩模使用期间由于清洁等而剥离多层反射膜的反射掩模板。 反射掩模坯料包括在基板上依次形成的多层反射膜,保护膜,吸收膜和抗蚀剂膜。 假设从基板的中心到多层反射膜的外周端的距离为L(ML),则从基板的中心到保护膜的外周端的距离为L(Cap), 从基板的中心到吸收膜的外周端的距离为L(Abs),并且从基板的中心到抗蚀剂膜的外周端的距离为L(Res),L (Ab)> L(Res)> L(Cap)≥L(ML),并且抗蚀剂膜的外周端位于衬底的外周端的内侧。

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