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Invention Grant
US09535463B2 Circuit board assembling structure, electronic device having the same and assembling method of electronic device 有权
电路板组装结构，具有相同的电子设备和电子设备的组装方法

Circuit board assembling structure, electronic device having the same and assembling method of electronic device
Abstract:
A circuit board assembling structure includes a first casing, a second casing, a dam and a circuit board. The first casing has an outer edge and at least a snap-engaging element. The second casing is coupled to the first casing. The dam is mounted on the first casing. The at least a snap-engaging element is disposed between the outer edge of the first casing and the dam. The circuit board is a resilient carrier which is snap-engaged with the at least a snap-engaging element, such that the circuit board is disposed between the outer edge of the first casing and the dam. Furthermore, an electronic device having the circuit board assembling structure and an assembling method of the electronic device are further provided.
Abstract(Chinese):

电路板组装结构包括第一壳体，第二壳体，坝和电路板。 第一壳体具有外边缘和至少一个卡扣接合元件。 第二壳体联接到第一壳体。 大坝安装在第一个外壳上。 至少一个卡扣接合元件设置在第一壳体的外边缘和坝之间。 电路板是与所述至少一个卡扣接合元件卡扣接合的弹性载体，使得电路板设置在第一壳体的外边缘和坝之间。 此外，还提供了具有电路板组装结构和电子设备的组装方法的电子设备。

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