Invention Grant
- Patent Title: Substrate liquid processing apparatus
- Patent Title (中): 基板液体处理装置
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Application No.: US14840237Application Date: 2015-08-31
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Publication No.: US09536761B2Publication Date: 2017-01-03
- Inventor: Yoshifumi Amano , Yuki Ito , Eiichiro Okamoto
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2014-178444 20140902
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
A substrate liquid processing apparatus includes a cup 50 configured to receive a processing liquid supplied onto a substrate. The cup includes a ring-shaped first exhaust space 530 in contact with a top opening 50A, and a ring-shaped second exhaust space 540 which is in contact with an exhaust port 52 and is disposed adjacent to the first exhaust space, and the first exhaust space and the second exhaust space communicate with each other intermittently or continuously along an entire circumference thereof. Further, the cup has an inner wall that confines an inner periphery of the second exhaust space, and the inner wall includes a first wall portion 581 serving as an upper part of the inner wall, and a second wall portion which serves as a lower part of the inner wall and is located at an inner position than the first wall portion in a radial direction.
Public/Granted literature
- US20160064256A1 SUBSTRATE LIQUID PROCESSING APPARATUS Public/Granted day:2016-03-03
Information query
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