Invention Grant
- Patent Title: Process for electroless copper deposition on laser-direct structured substrates
- Patent Title (中): 激光直接结构化基板上无电沉积铜的工艺
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Application No.: US14350971Application Date: 2012-10-10
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Publication No.: US09538665B2Publication Date: 2017-01-03
- Inventor: Edwin W. Bastenbeck , Harald Orschel , Ulrich Prinz
- Applicant: ENTHONE INC.
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Priority: EP11184516 20111010
- International Application: PCT/US2012/059547 WO 20121010
- International Announcement: WO2013/055786 WO 20130418
- Main IPC: B05D5/12
- IPC: B05D5/12 ; H05K3/18 ; C23C18/16 ; C23C18/20 ; C23C18/22 ; C23C18/30 ; C23C18/38 ; C23C18/42 ; B05D3/00
Abstract:
The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.
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