Invention Grant
US09543180B2 Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum
有权
在真空下在晶片载体和加工工具之间传送晶片的装置和方法
- Patent Title: Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum
- Patent Title (中): 在真空下在晶片载体和加工工具之间传送晶片的装置和方法
-
Application No.: US14449838Application Date: 2014-08-01
-
Publication No.: US09543180B2Publication Date: 2017-01-10
- Inventor: Tatsuo Kamiya
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer LLP
- Main IPC: H01L21/677
- IPC: H01L21/677
Abstract:
An integrated transport device for a wafer carrier includes: an evacuatable chamber for accommodating therein a wafer carrier having a front opening with a cover; a rotatable platform for placing the wafer carrier thereon in the chamber; and an opening/closing device for opening and closing the cover of the wafer carrier placed on the platform at a first position, wherein the platform rotates to set the wafer carrier at the first position and a second position for transporting a wafer to a wafer-handling chamber.
Public/Granted literature
- US20160035596A1 Apparatus And Method For Transporting Wafers Between Wafer Carrier And Process Tool Under Vacuum Public/Granted day:2016-02-04
Information query
IPC分类:
