Invention Grant
US09548252B2 Reworkable epoxy resin and curative blend for low thermal expansion applications
有权
可再生环氧树脂和低热膨胀应用的固化混合物
- Patent Title: Reworkable epoxy resin and curative blend for low thermal expansion applications
- Patent Title (中): 可再生环氧树脂和低热膨胀应用的固化混合物
-
Application No.: US14084564Application Date: 2013-11-19
-
Publication No.: US09548252B2Publication Date: 2017-01-17
- Inventor: Steven E. Lau , Steffanie S. Ung
- Applicant: RAYTHEON COMPANY
- Applicant Address: US MA Waltham
- Assignee: RAYTHEON COMPANY
- Current Assignee: RAYTHEON COMPANY
- Current Assignee Address: US MA Waltham
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/31 ; H01L23/48 ; C08L63/00 ; C08G59/50 ; C08K3/34 ; C08K3/36 ; C08K3/38 ; C08K3/40 ; C08K7/26 ; C08K7/28 ; C08K3/22 ; C08K7/16 ; C08K7/20 ; C09J163/00 ; H01L21/56 ; H01L23/00
Abstract:
A curable composition including: an epoxy resin; and an amine curing component including: an aromatic amine curing agent; and a solubilizer including an aliphatic amine, a cycloaliphatic amine, a non-volatile primary alcohol, non-volatile solvent or a mixture thereof. An electronic assembly including: a substrate; an underfill including a cured product of the curable composition on the substrate; and a ball grid array on the underfill is also disclosed.
Public/Granted literature
- US20150137362A1 REWORKABLE EPOXY RESIN AND CURATIVE BLEND FOR LOW THERMAL EXPANSION APPLICATIONS Public/Granted day:2015-05-21
Information query
IPC分类:
