Invention Grant
- Patent Title: Packaged semiconductor chips with array
- Patent Title (中): 阵列封装半导体芯片
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Application No.: US14753895Application Date: 2015-06-29
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Publication No.: US09548254B2Publication Date: 2017-01-17
- Inventor: Andrey Grinman , David Ovrutsky , Charles Rosenstein , Vage Oganesian
- Applicant: Tessera, Inc.
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L23/50
- IPC: H01L23/50 ; H01L23/31 ; H01L23/556 ; H01L25/10 ; H01L23/29 ; H01L23/00 ; H01L25/065 ; H01L23/498
Abstract:
A chip-sized, wafer level packaged device including a portion of a semiconductor wafer including a device, at least one packaging layer containing silicon and formed over the device, a first ball grid array formed over a surface of the at least one packaging layer and being electrically connected to the device and a second ball grid array formed over a surface of the portion of the semiconductor wafer and being electrically connected to the device.
Public/Granted literature
- US20150380336A1 PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY Public/Granted day:2015-12-31
Information query
IPC分类:
