Invention Grant
- Patent Title: Packaging for ultraviolet optoelectronic device
- Patent Title (中): 紫外光电子器件封装
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Application No.: US14708478Application Date: 2015-05-11
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Publication No.: US09548429B2Publication Date: 2017-01-17
- Inventor: Maxim S. Shatalov , Saulius Smetona , Alexander Dobrinsky , Michael Shur
- Applicant: Sensor Electronic Technology, Inc.
- Applicant Address: US SC Columbia
- Assignee: Sensor Electronic Technology, Inc.
- Current Assignee: Sensor Electronic Technology, Inc.
- Current Assignee Address: US SC Columbia
- Agency: LaBatt, LLC
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L33/00 ; H01L33/52 ; H01L33/50 ; H01L23/00
Abstract:
A solution for packaging an optoelectronic device using an ultraviolet transparent polymer is provided. The ultraviolet transparent polymer material can be placed adjacent to the optoelectronic device and/or a device package on which the optoelectronic device is mounted. Subsequently, the ultraviolet transparent polymer material can be processed to cause the ultraviolet transparent polymer material to adhere to the optoelectronic device and/or the device package. The ultraviolet transparent polymer can be adhered in a manner that protects the optoelectronic device from the ambient environment.
Public/Granted literature
- US20160027970A1 Packaging for Ultraviolet Optoelectronic Device Public/Granted day:2016-01-28
Information query
IPC分类:
