Invention Grant
US09550353B2 Apparatus and methods for micro-transfer-printing 有权
用于微转印的装置和方法

Apparatus and methods for micro-transfer-printing
Abstract:
In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.
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