Invention Grant
- Patent Title: Pattern forming method and resist composition
- Patent Title (中): 图案形成方法和抗蚀剂组成
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Application No.: US13636965Application Date: 2011-03-25
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Publication No.: US09551935B2Publication Date: 2017-01-24
- Inventor: Keita Kato , Shinji Tarutani , Toru Tsuchihashi , Sou Kamimura , Yuichiro Enomoto , Kana Fujii , Kaoru Iwato , Shohei Kataoka , Kazuyoshi Mizutani
- Applicant: Keita Kato , Shinji Tarutani , Toru Tsuchihashi , Sou Kamimura , Yuichiro Enomoto , Kana Fujii , Kaoru Iwato , Shohei Kataoka , Kazuyoshi Mizutani
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-069670 20100325; JP2011-056712 20110315
- International Application: PCT/JP2011/058376 WO 20110325
- International Announcement: WO2011/118855 WO 20110929
- Main IPC: G03F7/32
- IPC: G03F7/32 ; G03F7/039 ; G03F7/20 ; G03F7/004 ; G03F7/075

Abstract:
Provided is a method of forming a pattern, ensuring excellent exposure latitude (EL) and focus latitude (depth of focus DOF). The method of forming a pattern includes (A) forming a film from a resist composition, the resist composition, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent, thereby forming a negative pattern. The resist composition contains (a) a resin that is configured to decompose when acted on by an acid and ΔSP thereof represented by formula (1) below is 2.5 (MPa)1/2 or above, (b) a compound that is composed to generate an acid when exposed to actinic rays or radiation, and (c) a solvent. ΔSP=SPF−SPI (1)
Public/Granted literature
- US20130011785A1 PATTERN FORMING METHOD AND RESIST COMPOSITION Public/Granted day:2013-01-10
Information query
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