Invention Grant
US09552447B2 Systems and methods for controlling integrated circuit chip temperature using timing closure-based adaptive frequency scaling
有权
使用基于时序闭合的自适应频率缩放来控制集成电路芯片温度的系统和方法
- Patent Title: Systems and methods for controlling integrated circuit chip temperature using timing closure-based adaptive frequency scaling
- Patent Title (中): 使用基于时序闭合的自适应频率缩放来控制集成电路芯片温度的系统和方法
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Application No.: US14695091Application Date: 2015-04-24
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Publication No.: US09552447B2Publication Date: 2017-01-24
- Inventor: Jeanne P. Bickford , Eric A. Foreman , Mark W. Kuemerle , Susan K. Lichtensteiger
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Gibb & Riley, LLC
- Agent David A. Cain, Esq.
- Main IPC: G06F9/455
- IPC: G06F9/455 ; G06F17/50 ; G06F1/10

Abstract:
Disclosed are a system and method that control integrated circuit chip temperature using frequency scaling based on predetermined temperature-frequency settings. During integrated circuit chip operation, a controller causes a variable clock signal generator to adjust the frequency of a clock signal that coordinates operations of an integrated circuit chip based on the temperature of the integrated circuit chip and on predetermined temperature-frequency settings. The temperature-frequency settings are predetermined in order to ensure that the frequency of the clock signal, as adjusted, remains sufficiently high to meet a chip performance specification, but sufficiently low to prevent the temperature from rising above a predetermined maximum temperature in order to limit power consumption. Also disclosed is a method of generating such temperature-frequency settings during timing analysis.
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