Abstract:
Various embodiments include approaches for analyzing a set of travel pathways for a priority vehicle. In some cases, an approach includes: obtaining data indicating a location of the priority vehicle and a location of a destination for the priority vehicle; ranking each of a set of paths between the location of the priority vehicle and the location of the destination based upon a travel time for the priority vehicle along the set of paths; and sending instructions to vehicles on a highest-ranked path in the set of paths to initiate providing a right-of-way to the priority vehicle, wherein vehicles closer to the destination along the highest-ranked path are instructed to change a corresponding position prior to vehicles farther from the destination along the highest-ranked path.
Abstract:
Disclosed are a system and method that control integrated circuit chip temperature using frequency scaling based on predetermined temperature-frequency settings. During integrated circuit chip operation, a controller causes a variable clock signal generator to adjust the frequency of a clock signal that coordinates operations of an integrated circuit chip based on the temperature of the integrated circuit chip and on predetermined temperature-frequency settings. The temperature-frequency settings are predetermined in order to ensure that the frequency of the clock signal, as adjusted, remains sufficiently high to meet a chip performance specification, but sufficiently low to prevent the temperature from rising above a predetermined maximum temperature in order to limit power consumption. Also disclosed is a method of generating such temperature-frequency settings during timing analysis.
Abstract:
As disclosed herein, a method, executed by a computer, for integrated circuit timing variability reduction includes loading a netlist that corresponds to a chip design, where the chip design includes one or more circuits and a plurality of post-fill features, traversing a portion of the netlist corresponding to a circuit, determining a post-fill environment for the circuit from a plurality of post-fill features, and modeling a timing variance for the circuit based on the post-fill environment. The method may also include changing one or more post-fill features to achieve a targeted delay. The method may include generating a report of circuit timing and timing variances. One or more circuits can be concurrently traversed. The timing variance can be modeled with the use of a scaling factor for a standard timing variance. A computer system and computer program product corresponding to the method are also disclosed herein.
Abstract:
Methods and systems receive an integrated circuit design into a computerized device and perform an analysis of the integrated circuit design to identify characteristics of physical features of portions of the integrated circuit design. Such methods and systems determine whether to look up sensitivity of a timing value of a portion of the integrated circuit design to manufacturing process variables, voltage variables, and temperature variables (PVT variables) by: evaluating relationships between the characteristics of physical features of the portion of the integrated circuit design to generate an indicator value; and, based on whether the indicator value is within a table usage filter value range, either: calculating the sensitivity of the timing value to the PVT variables; or looking up a previously determined sensitivity of the timing value to the PVT variables from a look-up table.
Abstract:
Design methods and systems disclosed use a process window-aware timing analysis of an integrated circuit (IC) chip design for improved accuracy. Specifically, a process distribution for the design is defined and divided into process windows. Timing parameter adjustment factors are assigned to the process windows. A timing analysis is performed in order to acquire an initial solution for a timing parameter (e.g., delay, slack or slew). For each specific process window, this initial solution is adjusted by the predetermined timing parameter adjustment factor assigned to that specific process window. The adjusted solutions for the different process windows account for process window-to-process window variations in the widths of distribution of a process parameter (e.g., leakage power) and can be used to predict whether IC chips manufactured according the IC chip design will meet established timing requirements (e.g., required arrival times (RATs)) regardless of where they fall within the process distribution.
Abstract:
Methods and systems receive an integrated circuit design into a computerized device and perform an analysis of the integrated circuit design to identify characteristics of physical features of portions of the integrated circuit design. Such methods and systems determine whether to look up sensitivity of a timing value of a portion of the integrated circuit design to manufacturing process variables, voltage variables, and temperature variables (PVT variables) by: evaluating relationships between the characteristics of physical features of the portion of the integrated circuit design to generate an indicator value; and, based on whether the indicator value is within a table usage filter value range, either: calculating the sensitivity of the timing value to the PVT variables; or looking up a previously determined sensitivity of the timing value to the PVT variables from a look-up table.
Abstract:
Design methods and systems disclosed use a process window-aware timing analysis of an integrated circuit (IC) chip design for improved accuracy. Specifically, a process distribution for the design is defined and divided into process windows. Timing parameter adjustment factors are assigned to the process windows. A timing analysis is performed in order to acquire an initial solution for a timing parameter (e.g., delay, slack or slew). For each specific process window, this initial solution is adjusted by the predetermined timing parameter adjustment factor assigned to that specific process window. The adjusted solutions for the different process windows account for process window-to-process window variations in the widths of distribution of a process parameter (e.g., leakage power) and can be used to predict whether IC chips manufactured according the IC chip design will meet established timing requirements (e.g., required arrival times (RATs)) regardless of where they fall within the process distribution.