Invention Grant
- Patent Title: Transmission module, transmission cable, and connector
- Patent Title (中): 传输模块,传输电缆和连接器
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Application No.: US15207705Application Date: 2016-07-12
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Publication No.: US09553383B2Publication Date: 2017-01-24
- Inventor: Kazunao Oniki
- Applicant: Sony Corporation
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: K&L Gates LLP
- Priority: JP2013-118521 20130605
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/77 ; H01R13/66

Abstract:
A transmission module, a transmission cable, and a connector are provided. The transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a transmission cable component including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line are provided, wherein the cable side ground layer disposed at least at lower and upper sides of the signal line is folded, wherein a connector side ground layer electrically connected to the ground terminal is provided on the connector side substrate, and wherein the connector side ground layer disposed at least at lower and upper sides of an area where electromagnetic noises are generated is folded.
Public/Granted literature
- US20160322725A1 TRANSMISSION MODULE, TRANSMISSION CABLE, AND CONNECTOR Public/Granted day:2016-11-03
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