Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14950777Application Date: 2015-11-24
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Publication No.: US09559214B2Publication Date: 2017-01-31
- Inventor: Toshinari Sasaki
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: TYPHA IP LLC
- Priority: JP2014-243840 20141202
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L27/12

Abstract:
A semiconductor device includes a first electrode, a first insulating layer having a first opening reaching the first electrode and having a ring-shaped first side wall exposed to the first opening, an oxide semiconductor layer on the first side wall, the oxide semiconductor layer being connected with the first electrode, a gate insulating layer on the oxide semiconductor layer, the oxide semiconductor layer being between the first side wall and the gate insulating layer, a gate electrode facing the oxide semiconductor layer on the first side wall, the gate insulating layer being between the oxide semiconductor layer and the gate electrode, and a second electrode above the first insulating layer, the second electrode being connected with the oxide semiconductor layer.
Public/Granted literature
- US20160155851A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-06-02
Information query
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