Invention Grant
US09564697B2 Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same
有权
具有比PCB厚度短的焊接片的压配合电端子及其使用方法
- Patent Title: Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same
- Patent Title (中): 具有比PCB厚度短的焊接片的压配合电端子及其使用方法
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Application No.: US14540480Application Date: 2014-11-13
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Publication No.: US09564697B2Publication Date: 2017-02-07
- Inventor: Bert William Eakins , George E. Fox
- Applicant: LEAR CORPORATION
- Applicant Address: US MI Southfield
- Assignee: Lear Corporation
- Current Assignee: Lear Corporation
- Current Assignee Address: US MI Southfield
- Agency: Fishman Stewart PLLC
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01R12/58 ; H01R43/20 ; H01R4/02 ; H05K3/34 ; H05K3/40

Abstract:
A method of assembling a circuit board may include inserting a first electrical terminal into a first side of a circuit board, and applying a second layer of solder paste to a second side of the circuit board, the second side disposed opposite of the first side. The first electrical terminal may include a solder tab, a maximum length of the solder tab may be shorter than a minimum thickness of the circuit board, and if the first electrical terminal is inserted into the circuit board, the solder tab may extend at least partially into the circuit board without extending entirely through the circuit board. One or more electrical terminals with short and/or long solder tabs may be inserted into the second side of the circuit board and/or one or more electrical components may be attached to second side of circuit board.
Public/Granted literature
- US20160141776A1 PRESS FIT ELECTRICAL TERMINAL HAVING A SOLDER TAB SHORTER THAN PCB THICKNESS AND METHOD OF USING SAME Public/Granted day:2016-05-19
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