Invention Grant
- Patent Title: Intervertebral implant
- Patent Title (中): 椎间植入物
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Application No.: US13284747Application Date: 2011-10-28
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Publication No.: US09572681B2Publication Date: 2017-02-21
- Inventor: Claude Mathieu , Christopher Marden John Cain
- Applicant: Claude Mathieu , Christopher Marden John Cain
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, Inc.
- Current Assignee: DePuy Synthes Products, Inc.
- Current Assignee Address: US MA Raynham
- Agency: Baker & Hostetler LLP
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61B17/80 ; A61B17/86 ; A61F2/30
Abstract:
The intervertebral three-dimensional structure comprises a top side, an underside, a front face, a rear face, and a plurality of boreholes designed to receive affixation elements.
Public/Granted literature
- US20120109311A1 Intervertebral Implant Public/Granted day:2012-05-03
Information query
IPC分类:
