Invention Grant
- Patent Title: Conductive paste
- Patent Title (中): 导电胶
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Application No.: US14436565Application Date: 2013-10-18
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Publication No.: US09574091B2Publication Date: 2017-02-21
- Inventor: Yoshiaki Yoshii
- Applicant: NAMICS CORPORATION
- Applicant Address: JP Niigata-Shi, Niigata
- Assignee: NAMICS CORPORATION
- Current Assignee: NAMICS CORPORATION
- Current Assignee Address: JP Niigata-Shi, Niigata
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2012-231664 20121019
- International Application: PCT/JP2013/078260 WO 20131018
- International Announcement: WO2014/061765 WO 20140424
- Main IPC: H01B1/20
- IPC: H01B1/20 ; H01B1/22 ; C09D5/24 ; C09D7/12 ; C09D201/00 ; H05K1/09 ; H01B1/16 ; H05K1/18 ; H05K3/10
Abstract:
A conductive paste including: (A) a silver powder; (B) a glass frit; (C) an organic binder; and (D) a powder containing copper, tin, and manganese.
Public/Granted literature
- US20150299477A1 CONDUCTIVE PASTE Public/Granted day:2015-10-22
Information query
